Wafer and chip production

In the diffusion furnaces the raw material - the so called wafers - get their later diode behavior = pn-junction + special semiconductor characteristics. Then the wafers are sawed into single dice, the edges are cleaned and “passivated”, i. e. protected. Here the proprietary, environment-friendly Plasma-EPOS process is used, featuring double passivation for high reliability.

Challenging product ranges

Especially Zener and TVS diodes, with their large variety of partnames, are a major challenge with respect to base material, logistics and diffusion technology.
Diotec is one of the market leaders in this field, offering one of the widest range of products and fastest delivery time.

Case assembly and 100% testing

Lead wire, contact plug or lead frame, depending on case outline the chip has to be contacted differently. This is done by a solder process, for safe electrical contact. Then the parts are molded or casted, for protection and mechanical stability.

The RoHS compliant (leadfree) tinning provides long lasting solderability. After two times 100% testing of electrical parameters, the parts are marked and packaged. Extensive control of all process steps ensures always stable quality.